Lan Yin
lanyin@tsinghua.edu.cn
Chinese, English
Beijing
Tsinghua University
Materials Science and Engineering
  • 2007/08-2011/01 PhD in Materials Science and Engineering, Carnegie Mellon University, Supervisor: Prof. Sridhar Seetharaman
  • 2003/08-2007/07 Bachelor in Materials Science and Engineering, Tsinghua University
  • 2015/12-Present Associate Professor, Tsinghua University
  • 2012/05-2015/10 Postdoctoral Researcher, University of Illinois at Urbana-Champaign, Collaborative Supervisor: Prof. John A. Rogers
  • 2011/02-2012/04 Postdoctoral Researcher, Massachusetts Institute of Technology, Collaborative Supervisor: Prof. Donald R. Sadoway
  • 2014 MRS Fall Meeting Scholarship
  • 2010 Carnegie Mellon University Conference Scholarship
  • 2007 Carnegie Mellon University College of Engineering Scholarship
  • 2006 Tsinghua University Samsung Scholarship
  • 2005 Tsinghua University Scholarship
  • 2004 Tsinghua University Moutai Scholarship
Biodegradable electronic devices
Large-scale energy storage batteries
  • Dissolution Chemistry and Biocompatibility of Silicon- and Germanium-Based Semiconductors for Transient Electronics, L. Yin et al., 2015
  • Mechanisms for Hydrolysis of Silicon Nanomembranes as Used in Bioresorbable Electronics, L. Yin et al., 2015
  • Materials and Wireless Microfluidic Systems for Electronics Capable of Chemical Dissolution on Demand, L. Yin et al., 2015
  • Materials and Fabrication Sequences for Water Soluble Silicon Integrated Circuits at the 90 nm Node, L. Yin et al., 2015
  • Materials, Designs and Operational Characteristics for Fully Biodegradable Primary Batteries, L. Yin et al., 2014
  • Materials for high performance biodegradable semiconductor devices, L. Yin et al., 2014
  • Experimental and theoretical studies of serpentine microstructures bonded to prestrained elastomers for stretchable electronics, L. Yin et al., 2014
  • Dissolvable metals for transient electronics, L. Yin et al., 2014
  • A new anode material for oxygen evolution in molten oxide electrolysis, L. Yin et al., 2013
  • An analytical model of reactive diffusion for transient electronics, L. Yin et al., 2013
  • The effects of nickel/tin ratio on Cu induced surface hot shortness in Fe, L. Yin et al., 2011
  • Effects of residual elements arsenic, antimony, and tin on surface hot shortness, L. Yin et al., 2011
  • Effects of small additions of tin on high temperature oxidation of Fe-Cu-Sn alloys for surface hot shortness, L. Yin et al., 2010
  • Effects of nickel on the oxide/metal interface morphology and oxidation rate during high-temperature oxidation of Fe–Cu–Ni Alloys, L. Yin et al., 2010
  • Effects of nickel on interface morphology during oxidation of Fe-Cu-Ni Alloys, L. Yin et al., 2010
  • Effects of small additions of copper and copper + nickel on the oxidation behavior of iron, L. Yin et al., 2008
Biodegradable Electronics Medical Applications Environmental Safety Surgery Avoidance Material Science Energy Storage Renewable Energy Grid Management Distributed Generation

Contact us

Let's talk!
* Required
* Required
* Required
* Invalid email address
By submitting this form, you agree that IoT ONE may contact you with insights and marketing messaging.
No thanks, I don't want to receive any marketing emails from IoT ONE.
Submit

Thank you for your message!
We will contact you soon.