• >
  • >
  • >
  • >
  • >
Wei Liu
Materials Science and Engineering
Tsinghua University
Beijing
Language: Chinese, English
Contact
Electromagnetic Metallurgy Physical Fields Materials Science Metal Deformation Microstructure New Energy Metal Materials Research Technology
Areas of Focus
  • Interaction between strong physical fields and materials and electromagnetic metallurgy
  • Metal deformation and microstructure
  • New energy metal materials
Work Experience
  • 1996.04-1997.11 - Postdoctoral Researcher, Tsinghua University, Department of Materials Science
  • 2001.06-2002.06 - Visiting Scholar, University of California, Berkeley, USA
  • 1997.12-Present - Assistant Researcher, Associate Professor, Professor, Tsinghua University, School of Materials Science
Academic Background & Achievements
  • 1989.07 Bachelor: Northeastern University, School of Materials and Metallurgy, China
  • 1992.02 Master: Northeastern University, School of Materials and Metallurgy, China
  • 1995.11 PhD: Northeastern University, School of Materials and Metallurgy, China
Publications
  • The transformation of carbides during austenization and its effect on the wear resistance of high speed steel rolls, Zhang, XD; Liu, W; Sun, DL; et al., 2007
  • A technique for controlling the alignment of silver nanowires with an electric field, Cao, Y; Liu, W; Sun, JL; et al., 2006
  • Development of the Cube texture at low annealing temperatures in highly rolled pure nickel, Li, X; Liu, W; Godfrey, A; et al., 2007
  • Characterization of microtexture in Bi-2223 tapes using electron back-scatter pattern orientation imaging, Liu, W; Lin, D; Godfrey, A; et al., 2005
  • Effects of electrical field treatment on recrystallization of copper single crystal, Liu, W; Wu, TK; Godfrey, A; et al., 2005
Post a Project

Contact us

Let's talk!
* Required
* Required
* Required
* Invalid email address
By submitting this form, you agree that AGP may contact you with insights and marketing messaging.
No thanks, I don't want to receive any marketing emails from AGP.
Submit

Thank you for your message!
We will contact you soon.